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Precision Communication PCB For Wireless Module Integration & Iot Connectivity Solutions

Shenzhen Xunsiwei Circuit Co., Ltd.
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    Buy cheap Precision Communication PCB For Wireless Module Integration & Iot Connectivity Solutions from wholesalers
     
    Buy cheap Precision Communication PCB For Wireless Module Integration & Iot Connectivity Solutions from wholesalers
    • Buy cheap Precision Communication PCB For Wireless Module Integration & Iot Connectivity Solutions from wholesalers

    Precision Communication PCB For Wireless Module Integration & Iot Connectivity Solutions

    Ask Lasest Price
    Price : Negotiable
    Certification : UL ,IOS9000
    Brand Name : XSW PCB
    Payment Terms : Western Union
    Delivery Time : 8-15DAYS
    Supply Ability : 1 Million Square feet/per month
    Model Number : XSWPCB
    • Product Details
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    Precision Communication PCB For Wireless Module Integration & Iot Connectivity Solutions

    Precision Communication PCB

    Tailored for integration into wireless communication modules and IoT connectivity solutions

    Product Specifications
    Layer Count4L
    MaterialFR4-TG140
    Board Thickness1.6 MM
    Copper Thickness1/1/1/1 oz
    Minimum Hole Size0.2 mm
    Minimum Line Width0.12 mm
    Minimum Line Spacing0.1 mm
    Solder Mask ColorBlue
    Surface FinishENIG (Electroless Nickel Immersion Gold)
    Application FieldCommunication Products
    Key Features: 4-layer PCB, 0.2mm BGA pitch, with gold fingers
    Xunsiwei PCB — Born for High-Speed Communication, Practitioner of 0.2mm BGA Precision Interconnection

    We understand that the core of communication boards lies not in simple "layer count stacking," but in ensuring signal integrity under extreme precision scenarios. Xunsiwei focuses on BGA packaging and HDI technologies, providing deep solutions from design optimization to volume delivery for high-performance communications, IoT gateways, and intelligent electronic systems.

    In-Depth Customization Capabilities

    Our understanding of "customization" goes beyond simple dimensional modifications—it's about collaborative optimization starting from the design phase:

    • DFM Pre-Assessment: Intervention during your layout and routing phase to anticipate potential risks in BGA fan-out, impedance stack-up, and gold finger tracing
    • Special Process Combination Capability: Simultaneous realization of 0.2mm BGA + gold fingers + selective ENIG + impedance control on 4-layer boards, formed in one process—no secondary processing required
    Reliability Assurance System
    Test ItemIndustry Standard (Spot Check)Xunsiwei Standard
    Electrical TestFlying probe spot check100% full inspection (flying probe + fixture), zero tolerance for open/short circuits
    AOI InspectionOuter layer onlyFull-process AOI for inner and outer layers, no hiding place for fine line defects
    Thermal Stress Test288℃/10S288℃/20S, 3 cycles, simulating extreme operating conditions
    Impedance ConsistencyFirst article confirmationBatch sampling + SPC process control, CpK ≥ 1.33
    Quality Precision Communication PCB For Wireless Module Integration & Iot Connectivity Solutions for sale
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