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12 Layers Server Communication PCB For Fast Secure Data Processing And Storage

Shenzhen Xunsiwei Circuit Co., Ltd.
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    Buy cheap 12 Layers Server Communication PCB For Fast Secure Data Processing And Storage from wholesalers
     
    Buy cheap 12 Layers Server Communication PCB For Fast Secure Data Processing And Storage from wholesalers
    • Buy cheap 12 Layers Server Communication PCB For Fast Secure Data Processing And Storage from wholesalers

    12 Layers Server Communication PCB For Fast Secure Data Processing And Storage

    Ask Lasest Price
    Model Number : XSWPCB
    Delivery Time : 8-15DAYS
    Payment Terms : Western Union
    Supply Ability : 1 Million Square feet/per month
    Certification : UL ,IOS9000
    Price : Negotiable
    Brand Name : XSW PCB
    • Product Details
    • Company Profile

    12 Layers Server Communication PCB For Fast Secure Data Processing And Storage

    12 Layers Server Communication PCB For Fast Secure Data Processing And Storage


    The 12 Layers Server Communication PCB is engineered for high-speed data processing, secure communication, and large-scale data storage applications. Designed with a complex multilayer stack-up, this PCB provides exceptional signal integrity, power distribution efficiency, and electromagnetic interference (EMI) suppression required by modern servers, data centers, cloud computing platforms, and communication equipment.

    Manufactured using high-quality low-loss materials and advanced PCB fabrication technology, the board supports high-frequency signal transmission, high-density component integration, and reliable long-term operation. Its 12-layer architecture enables optimized routing for high-speed interfaces, ensuring stable performance in mission-critical networking, storage, and enterprise computing environments.


    Key Specifications
    Layer Count12-Layer
    MaterialFR4
    Board Thickness1.6 mm (Customizable)
    Copper Thickness1/1/1/1/1/1/1/1/1/1/1/1 oz
    Minimum Hole Size0.25 mm
    Minimum Line Width0.1 mm
    Minimum Line Spacing0.1 mm
    Solder Mask ColorGreen
    Surface FinishENIG

    Product Description

    • 12-Layer High-Density Design
      • Provides ample routing space for complex server and communication circuits.
      • Supports high-density component placement and advanced processor architectures.
    • High-Speed Signal Integrity
      • Optimized stack-up structure minimizes signal loss, crosstalk, and transmission delays.
      • Suitable for high-speed networking and data communication protocols.
    • Fast Data Processing Capability
      • Designed to support multi-core processors, memory modules, and high-bandwidth interfaces.
      • Enables efficient data transfer within server and storage systems.
    • Enhanced Data Security and Reliability
      • Stable power distribution and signal routing help ensure secure and uninterrupted system operation.
      • Reduces communication errors in critical applications.
    • Excellent EMI and EMC Performance
      • Multiple ground and power planes improve electromagnetic compatibility.
      • Minimizes interference in high-frequency environments.
    • Design Specifications
    ItemMass Production CapabilityExtreme Capability
    Board Thickness Range0.3~6.0mm0.3~6.0mm
    Exposure Alignment Accuracy±0.015mm±0.005mm
    Minimum Annular RingSingle side ≥0.05mmSingle side ≥0.05mm
    Min Line Width/Space (1/3oz base copper)0.05mm / 0.05mm0.045mm / 0.045mm
    Min Line Width/Space (1/2oz base copper)0.05mm / 0.05mm0.05mm / 0.05mm
    Min Line Width/Space (1oz base copper)0.075mm / 0.075mm0.075mm / 0.075mm
    Etching Tolerance (1/3oz base copper)±0.005mm±0.005mm
    Etching Tolerance (1/2oz base copper)±0.005mm±0.005mm
    Etching Tolerance (1oz base copper)±0.0075mm±0.0075mm
    Gold Finger Total Pitch Tolerance<30mm: ±0.05mm
    30~60mm: ±0.075mm
    <30mm: ±0.03mm
    30~60mm: ±0.05mm
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